Wafer Dicing and Backgrinding
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Advanced Search Powered by KSearch 1.5b Wafer Dicing and BackgrindingPrecision wafer dicing and backgrinding services provided for prototype, R&D, as well as high volume production wafer dicing requirements to semiconductor, nanotechnology, MEMS, microwave, optoelectronic, and hybrid circuit industries.Other services related to wafer dicing, sawing and singulating include wafer and substrate edge grinding, rounding, chamfering, blending, and polishing. Also V-grooves, laser slag removal, pyramids, slots, and steps on all types of materials including Glass, AlN, Ceramics, Silicon Carbide, GaP and InP, Quartz, Silicon, Ferrites, Sapphire, Germanium, bonded wafers, and bumped wafers. Whether the requirements are for laser diode mounts, chip capacitors or resistors, patterned optics, hybrid microcircuits, IC chips, laser diodes, metallic materials, ultra thin substrates and wafers or high voltage silicon wafer stacks, we do it all. Starting material sizes can vary from 6x6 in. wafer to 8x18 in. plates. Depending on the material, dicing kerf may be as small as .001" and die sizes as small as .005" square. Wafer dicing related Web pages:
Return to Home Page: Dicing hybrid, semiconductor and dicing MEMS wafers Updated: 21 Jan 2009 |
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