Sapphire Wafer Dicing

For electronic, photonic and mechanical applications, Sapphire wafers and substrates are unequaled for strength and endurance.

Sapphire wafers and substrates come in many orientations, the most common being A-Plane and C-Plane (very machinable) and R-Plane (difficult to machine). Each offers different optical characteristics unimportant for mechanical applications. This is a difficult material to dice, however Valley's process produces the least amount of chipping possible. On edges which require an optical quality surface, Valley also offers optical edge and angle polishing of these end faces.

For a complete summary of dicing capabilities click here.

Dicing related Web sites:

• www.customdicing.com/wafer-dicing Wafer dicing
• www.customdicing.com/edge-rounding Diced chip and substrate edge-rounding
• www.customdicing.com/custom-dicing Custom wafer dicing, cutting, sawing and singulating
• www.customdicing.com/thin-dice Thin dice by thinning after dicing
• www.sapphirewafers.com Sapphire wafers and substrates

Return to Home Page: Dicing hybrid, semiconductor and dicing MEMS wafers

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