Sapphire Wafer Dicing
|
Advanced Search Powered by KSearch 1.5b Sapphire Wafer DicingFor electronic, photonic and mechanical applications, Sapphire wafers and substrates are unequaled for strength and endurance.Sapphire wafers and substrates come in many orientations, the most common being A-Plane and C-Plane (very machinable) and R-Plane (difficult to machine). Each offers different optical characteristics unimportant for mechanical applications. This is a difficult material to dice, however Valley's process produces the least amount of chipping possible. On edges which require an optical quality surface, Valley also offers optical edge and angle polishing of these end faces. For a complete summary of dicing capabilities click here. Dicing related Web sites:
Return to Home Page: Dicing hybrid, semiconductor and dicing MEMS wafers Updated: 21 Jan 2009 |
|||||||||
|
|
© 2008 Valley Design Corp. All Rights Reserved |