Dicing Metallic Materials and Substrates

All materials diced with precision backed by 30 years of experience. Metal coated substrates and direct bond Copper DBC substrates are handled expertly and all efforts are made to avoid "clumping" of the coating on the edges.

Thicker metal parts also can be cut to your specifications. Depending upon the material, the dicing kerf may be as small as 0.001". The company's capabilities enable you to better handle production pressures and meet your requirements for kerf, specifications, and delivery.

For a complete summary of dicing capabilities click here.

Return to Home Page: Dicing hybrid, semiconductor and dicing MEMS wafers

AlN substrates Dicing MEMS wafers Capacitor chip dicing Dicing Edge rounding Dice thinning Wafer vacuum chucks AlN heat sinks Dicing ceramics Custom dicing Diamond dicing Ferrite dicing Polished silicon wafers Lapping web pages High purity silicon Precision optical dicing Dicing sapphire Wafer dicing

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Return to top of page		Updated: 6 May 2008
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