Dicing Metallic Materials and Substrates
All materials diced with precision backed by 30 years of experience. Metal coated substrates and direct bond Copper DBC substrates are handled expertly and all efforts are made to avoid "clumping" of the coating on the edges.
Thicker metal parts also can be cut to your specifications. Depending upon the material, the dicing kerf may be as small as 0.001". The company's capabilities enable you to better handle production pressures and meet your requirements for kerf, specifications, and delivery.
For a complete summary of dicing capabilities click here.
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