Dicing and Polishing Ferrite Materials

Although these brittle materials present special problems when diced and polished, great effort is taken to do everything possible to minimize chipping and breakage.

The company's 30 year experience with ferrite materials allows to advise customers concerning tolerances, surface finishes and chip specifications. Dicing, shaping and polishing services are provided for both R&D as well as high volume production. Other services include chamfering, edge polishing, lapping, thinning and wafering.

For a complete summary of company's dicing capabilities click here. This service is available on both, East and West coasts.

Return to Home Page: Dicing hybrid, semiconductor and dicing MEMS wafers

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