Dicing and Polishing Ferrite Materials

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Although these brittle materials present special problems when diced and polished, great effort is taken to do everything possible to minimize chipping and breakage.

The company's 30 year experience with ferrite materials allows to advise customers concerning tolerances, surface finishes and chip specifications. Dicing, shaping and polishing services are provided for both R&D as well as high volume production. Other services include chamfering, edge polishing, lapping, thinning and wafering.

For a complete summary of company's dicing capabilities click here. This service is available on both, East and West coasts.

AlN substrates Dicing MEMS wafers Capacitor chip dicing Dicing Edge rounding Dice thinning Wafer vacuum chucks AlN heat sinks Dicing ceramics Custom dicing Diamond dicing Polished silicon wafers Lapping web pages Dicing metal mtrls. High purity silicon Precision optical dicing Dicing sapphire Wafer dicing

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