Substrate and Microchip Edge Rounding

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Substrate and Microchip Edge Rounding

Edge Shaping and Beveling - Edge Grinding and Polishing

A unique edging process could solve your microchip, window, and substrate corner rounding problems.

  • Edge rounding and chamfering
  • Edge shaping and beveling
  • Edge lapping and polishing
  • Edge deburring and blending
  • Laser slag removal - click here for more information
  • Sharp corner rounding and deburring
  • Prepare edges for circuit wraparound applications
  • Enhanced - via edge rounding and contouring

The degree of rounding is controllable to a few microns. This process is adaptable to most materials including Ceramics, Fused quartz-Silica, Glass, Silicon, Aluminum Nitride, hard metals, and various other hard and semi-hard materials.

For more information, go to:

Return to Home Page: Dicing hybrid, semiconductor and dicing MEMS wafers

Updated: 21 Jan 2009

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