Substrate and Microchip Edge Rounding

Edge Shaping and Beveling - Edge Grinding and Polishing

A unique edging process could solve your microchip, window, and substrate corner rounding problems.

• Edge rounding and chamfering
• Edge shaping and beveling
• Edge lapping and polishing
• Edge deburring and blending
• Laser slag removal - click here for more information
• Sharp corner rounding and deburring
• Prepare edges for circuit wraparound applications
• Enhanced - via edge rounding and contouring

The degree of rounding is controllable to a few microns. This process is adaptable to most materials including Ceramics, Fused quartz-Silica, Glass, Silicon, Aluminum Nitride, hard metals, and various other hard and semi-hard materials.

For more information, go to:

• www.laserslag.com Laser hole and edge chamfering and blending
• www.edgepolishing.com Edge and angle polishing
• www.siliconwafers.net/edge-rounding Substrate edge rounding and blending
• www.semi.org SEMI Semiconductor wafer edge rounding specifications
• www.customdicing.com/wafer-dicing Wafer dicing, sawing, singulating and backgrinding

Return to Home Page: Dicing hybrid, semiconductor and dicing MEMS wafers

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