Substrate and Microchip Edge Rounding

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Edge Shaping and Beveling - Edge Grinding and Polishing

A unique edging process could solve your microchip, window, and substrate corner rounding problems.

The degree of rounding is controllable to a few microns. This process is adaptable to most materials including Ceramics, Fused quartz-Silica, Glass, Silicon, Aluminum Nitride, hard metals, and various other hard and semi-hard materials.

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