Dicing and Sawing of All Types of Materials

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Dicing and Sawing of All Types of Materials

Dicing and backgrinding of:

  • Sapphire substrates and wafers
  • Ceramic substrates, Piezo Ceramics and hybrid circuits
  • Capacitors - chips
  • Quartz, Fused Silica, and Glass, substrates wafers and plates
  • Semiconductor and compound semiconductor materials
  • Thin metals and small diameter rods
  • Ferrites
  • Bonded wafers and MEMS wafers and substrates
  • And all types of special materials

Cutting and Shaping:

  • Thick plates and rods
  • Grooves and slots
  • Pyramids
  • Round, bevel, and chamfer
  • Cut steps

For a complete summary of company's dicing capabilities click here.

Please click here for a dicing quotation per your specifications.

Informative dicing Web sites:

Return to Home Page: Dicing hybrid, semiconductor and dicing MEMS wafers

Updated: 21 Jan 2009

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