Dicing and Sawing of All Types of Materials

Dicing and backgrinding of:

• Sapphire substrates and wafers
• Ceramic substrates, Piezo Ceramics and hybrid circuits
• Capacitors – chips
• Quartz, Fused Silica, and Glass, substrates wafers and plates
• Semiconductor and compound semiconductor materials
• Thin metals and small diameter rods
• Ferrites
• Bonded wafers and MEMS wafers and substrates
• And all types of special materials

Cutting and Shaping:

• Thick plates and rods
• Grooves and slots
• Pyramids
• Round, bevel, and chamfer
• Cut steps

For a complete summary of company’s dicing capabilities click here.

Please click here for a dicing quotation per your specifications.

Informative dicing Web sites:

• https://valleydesign.com/custom-dicing/bonded-wafers/ Dicing MEMS wafers
• https://valleydesign.com/custom-dicing/custom-dicing/.htm Custom dicing
• https://valleydesign.com/request-a-quote Precision optical dicing
• https://valleydesign.com/custom-dicing/thin-dice/ Thin dice by thinning after dicing
• https://valleydesign.com/custom-dicing/wafer-dicing/ Wafer dicing, sawing, singulating and backgrinding