Dicing and Sawing of All Types of Materials

Dicing and backgrinding of:

• Sapphire substrates and wafers
• Ceramic substrates, Piezo Ceramics and hybrid circuits
• Capacitors - chips
• Quartz, Fused Silica, and Glass, substrates wafers and plates
• Semiconductor and compound semiconductor materials
• Thin metals and small diameter rods
• Ferrites
• Bonded wafers and MEMS wafers and substrates
• And all types of special materials

Cutting and Shaping:

• Thick plates and rods
• Grooves and slots
• Pyramids
• Round, bevel, and chamfer
• Cut steps

For a complete summary of company's dicing capabilities click here.

Please click here for a dicing quotation per your specifications.

Informative dicing Web sites:

• www.customdicing.com/bonded-wafers.htm Dicing MEMS wafers
• www.customdicing.com/custom-dicing.htm Custom dicing
• www.customdicing.com/rfq.htm Precision optical dicing
• www.customdicing.com/thin-dice.htm Thin dice by thinning after dicing
• www.customdicing.com/wafer-dicing.htm Wafer dicing, sawing, singulating and backgrinding

Return to Home Page: Dicing hybrid, semiconductor and dicing MEMS wafers

AlN substrates Dicing MEMS wafers Capacitor chip dicing Edge rounding Dice thinning Wafer vacuum chucks AlN heat sinks Dicing ceramics Custom dicing Diamond dicing Ferrite dicing Polished silicon wafers Lapping web pages Dicing metal mtrls. High purity silicon Precision optical dicing Dicing sapphire Wafer dicing

VALLEY DESIGN NEWS

Return to top of page		Updated: 6 May 2008
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