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Dicing, Slicing, Sawing and Singulating
Custom dicing with increased capacity
in advanced high-speed CNC dicing, cutting, sawing, and singulating, enabling
us to provide a complete spectrum of different shapes and materials.
Dicing, Sawing, Singulating
Quartz, Fused Silica, Glass:
We dice Valley supplied or customer material for optical, commercial, or substrate
use. Valley also stocks
these materials.
Wafers,
semiconductor materials, compound semiconductor materials: Valley
dices wafers -Silicon, GaAs, InP, GaP, etc.- up to 6" in diameter or square
and up to 6"x14" rectangles, and any thickness.
Ceramic
substrates, Piezo Ceramics, hybrid substrate sawing: We are experts
at dicing Aluminum Nitride AlN Aluminas with and without circuitry. Valley Design
also stocks
these materials.
Capacitors: We
have extensive experience with all dielectric materials.
Sapphire: Our process
allows us to saw this material with minimum possible chipping.
Metals:
Thin metal plates or metal coated substrates diced per your prints.
Ferrites:
Valley has extensive experience with brittle materials. Our process keeps chipping
to a minimum.
Bonded
wafers: Silicon and GaAs bonded to Glass, Quartz, and other bonded
wafers are expertly diced at Valley.
Special
materials: Valley is familiar with the special characteristics
of many exotic materials including Niobates, Titanates, Fluorides, Cadmium Telluride,
Zinc Selenide, Silicon Carbide, Molybdenum, and Lanthanum Aluminate. We also
develop dicing/cutting procedures for untried materials.
Wafers:
Dicing of coated, patterned and circuited wafers is our specially.
Cutting
Thick
plates, various materials: Valley will cut Quartz, Ceramics,
and Glass for optical and commercial use.
Rods:
Quartz, Glass, Metal, Sapphire. We supply accurate cutting of pivots and other
small precision parts.
Grooves
and Slots: Valley will cut slots, grooves (V-grooves or U-grooves)
per your print in Ceramics, Ferrites, Glass, Quartz, AIN, and other materials.
Pyramids:
Pyramids can be scored on many hard materials, Glass, Quartz, and Silicon Carbide,
for example.
Shaping:
Valley will round, bevel, and/or chamfer your parts to the shape that is most
efficient for your needs.
Steps:
We will machine steps into shims, laser diodes or other parts requiring critical
measurements.
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I. Dicing, Sawing, Singulating
- Quartz,
Fused Silica, Glass
Valley provides precision
dicing services for both R & D efforts as well as high volume contract
dicing requirements. We also offer accurate dicing for customer materials
up to 6" in diameter for Quartz, Fused Silica, and Glass disks. For
large thick plates, we also offer precision cutting services. Depending
upon the material, the dicing kerf may be as small as .001". Our
capabilities enable you to better handle production pressures as we meet
your requirements for kerf, chip specifications, and delivery.
- Wafers,
semiconductor materials, compound semiconductors
Valley provides precision
dicing services for both R & D efforts as well as high volume contract
dicing requirements. Our dicing saws can handle wafers up to 6" in
diameter. We offer accurate dicing for Silicon wafers, bonded wafers like
Silicon-on-Glass, as well as delicate compound semiconductors like GaP
and InP. Depending on the material, dicing kerf may be as small as .001"
and die size as small as .005" square. We will dice and ship your
wafers on tape or other carriers.
- Ceramic
substrates, Piezo Ceramics, hybrid substrate sawing
Valley offers precision dicing
services for both R & D efforts as well as high volume contract dicing
for customer Ceramic materials up to 6" in diameter, including Alumina,
Aluminum Nitride, Macor, Piezo Ceramics as well as hybrid substrates.
Our capabilities enable you to better handle production pressures as we
meet your requirements for kerf, chip specifications, and delivery. Depending
upon the material, the dicing kerf may be as small as .001".
- Capacitors
Valley is well experienced
in dicing capacitor chips in rectangular, hexagonal and other geometric
patterns with a kerf as low as .002". Our dicing saws are fully programmable
and are equipped with a high power microscope and video for precision
alignment. Our capabilities extend your fabrications services, and enable
you to meet production deadlines as we meet your requirements for kerf,
chip specifications and delivery.
- Sapphire
For electronic, photonic and
mechanical applications, Sapphire is unequalled for strength and endurance.
Sapphire comes in many orientations, the most common being A-Plane and
C-Plane (very machinable) and R-Plane (difficult to machine). Each offers
different optical characteristics unimportant for mechanical applications.
This is a difficult material to dice, but our process produces the least
amount of chipping possible.
- Metals
Any diceable material including
Copper, Aluminum, and other thin metals may be diced at Valley with precision.
Metal coated substrates are handled expertly and all efforts are made
to avoid "clumping" of the coating on the edges. Thicker metal parts can
be cut to your specifications. Depending upon the material, the dicing
kerf may be as small as .001". Our capabilities enable you to better
handle production pressures as we meet your requirements for kerf, specifications,
and delivery.
- Ferrites
Although these brittle materials
present special problems when diced, we will do everything possible to
minimize chipping. Our extensive experience with these materials allow
us to advise customers concerning tolerances and chip specifications.
Valley provides precision dicing services for both R & D efforts as
well as high volume contract dicing requirements. For one large government
funded firm, Valley's reliable service has enabled scientists to expand
their investigations of many ferrite materials.
- Bonded
Wafers
Whether or not your bonded
wafers have etched patterns or circuitry, we will provide precise dicing
of your chips. Valley has the technology to handle Silicon-on-Glass, GaAs-on-Glass
or Quartz , and any other bonded wafers. Depending on the material, the
dicing kerf may be as small as .001" and the die size as small as
.005" square. Valley provides precision dicing services for both
R & D efforts as well as high volume contract dicing requirements.
- Special
Materials
Very often, Valley performs
prototype dicing and cutting processes crucial to research projects on
exotic and untried materials. In the past we have cut soft semiconductor
materials like Mercury Cadium Telluride and crystals for optics requiring
special handling. Some are hydroscopic like Cesium Bromide or Barium Floride.
Occasionally we are asked to cut magnetic materials and control the charge
of each part. Whatever the requirement, Valley is committed to working
out a process to give each customer a desirable product and yield.
- Wafers
Wafer dicing is critical to
devise and circuit performance and reliability. Dicing of coated, patterned
and circuited wafers is our specialty.
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II. Cutting
- Thick
plates
In addition
to saws dedicated solely to dicing thin materials, Valley has saws especially
suited to precise cutting of thick Quartz, Glass, and Ceramic plates.
Even materials 6-8 mm thick will be cut accurately. Some orders we have
recently filled include cutting and machining spacers 1" diameter
by 15" long from Macor, 5"x 5" x 3 mm thick quartz plates,
3" diameter by 250" Gallium Arsenide pucks cut per supplied
print.
- Rods
Valley is
experienced in cutting small precision parts from a variety of materials.
Regularly, we cut stainless steel and carbide rods into small pivots.
We have cut quartz rods 1 mm in diameter into lengths of 0.01" and
polished the ends. Our engineering strengths developed over the past 30
years enable us to develop processes to make parts other companies may
find too difficult.
- Grooves
and Slots
Our engineers
will create processes to fulfill print requirements for slots, V-grooves
and U-grooves. Recently, we were requested to slot heat sinks made from
2.25" square BeO blanks. The slot details were 0.075 mm x 1.2 mm
for an aerospace giant, Valley produced many precision grooved and slotted
Aluminum Nitride parts 4 and 6.5 mm thick which fit together in an "ice
cube tray" pattern.
- Pyramids
Seven or eight
years ago, we received our first request to score pyramids on Silicon
Carbide disks. Our technicians developed a process that delighted the
customer, who initially had doubts about the feasibility of his project.
Since then, we have successfully scored intricate and delicate pyramid
patterns on ceramics, quartz, and glass. For one of our regular customers,
we have machined our standard blades to precise angles in order to meet
the required 60 degree angled upper and lower kerfs of pyramids cut into
fused silica wafers.
- Shaping
Valley has
facilities to round, bevel, and chamber parts to the shape needed for
custom fixtures. We require clear prints and the specific tolerances necessary
for each part. One of our customers utilizes a glass disk produced by
Valley with a centrally placed hole that must fit exactly into the fixture
for which it is designed.
- Steps
One research
firm asked Valley to machine precisely configured steps with tight tolerances
into molybdenum blanks measuring .8 x .35 x .105 in. We have the capability
to machine steps into your shims, laser diodes or other parts requiring
critical measurements.
Custom dicing, sawing, cutting and singulating related Web sites:
Return to Home Page:
Dicing hybrid, semiconductor and dicing MEMS wafers
Updated: 21 Jan 2009
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