Ceramic Substrate Dicing

Dicing services for all types of substrates and wafers for MEMS, SOI, DBC, optics, semiconductor and hybrid circuit industries. With two facilities, the company can serevice your R&D and high volume production dicing of wafers and substrates up to 6" in diameter or square, including Alumina, Aluminum Nitride, Macor, Piezo Ceramics as well as hybrid substrates.

These capabilities enable you to better handle production pressures and meet the requirements for kerf, chip specifications, and delivery. Depending upon the material, the dicing kerf may be as small as .001".

Extensive stock of thin substrates that are ideal for thin and thick film chip capacitor and chip resistor manufacturing. These materials include 96% and 99.6% Alumina Ceramics, Aluminum Nitride, Fused Silica, Glass and many others.

For a complete summary of company's dicing capabilities click here.

Return to Home Page: Dicing hybrid, semiconductor and dicing MEMS wafers

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