Ceramic Substrate Dicing
Dicing services for all types of substrates and wafers for MEMS, SOI, DBC, optics, semiconductor and hybrid circuit industries. With two facilities, the company can service your R&D and high volume production dicing of wafers and substrates up to 6" in diameter or square, including Alumina, Aluminum Nitride, Macor, Piezo Ceramics as well as hybrid substrates.
These capabilities enable you to better handle production pressures and meet the requirements for kerf, chip specifications, and delivery. Depending upon the material, the dicing kerf may be as small as .001".
For a complete summary of company's dicing capabilities click here.