Chip Capacitor and Resistor Dicing

Years of extensive experience in dicing capacitor chips and resistor chips in rectangular, hexagonal and other geometric patterns with a kerf as low as .002".

Dicing saws are fully programmable and are equipped with microscope and video for precision alignment. The company's capabilities extend your fabrication services, and help you to meet production deadlines as your requirements for kerf, chip specifications and delivery are satisfied.

Extensive stock of thin substrates that are ideal for thin and thick film chip capacitor and chip resistor manufacturing. These materials include 96% and 99.6% Alumina Ceramics, Aluminum Nitride, Fused Silica, Glass and many others.

For a complete summary of dicing capabilities click here.

Chip capacitor dicing and material related dicing Web pages:

• www.ultra-thin.com/chip-capacitors Chip capacitors Ceramic substrates
• www.customdicing.com/edge-rounding Diced chip and lasered substrate edge rounding
• www.valleydesign.com/substrate Aluminum Nitride and Alumina Ceramic substrates
• www.acers.org American Ceramic Society
• www.customdicing.com/wafer-dicing Wafer dicing, sawing, singulating and wafer backgrinding

Return to Home Page: Dicing hybrid, semiconductor and dicing MEMS wafers

AlN substrates Dicing MEMS wafers Dicing Edge rounding Dice thinning Wafer vacuum chucks AlN heat sinks Dicing ceramics Custom dicing Diamond dicing Ferrite dicing Polished silicon wafers Lapping web pages Dicing metal mtrls. High purity silicon Precision optical dicing Dicing sapphire Wafer dicing

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