MEMS Bonded Wafer Dicing
Whether or not your bonded wafers have etched patterns or circuitry, we will provide precise dicing of your chips.
Valley has the technology to handle Silicon-on-Glass, GaAs-on-Glass or Quartz , and any other bonded wafers. Depending on the material, the dicing kerf may be as small as 1mil (25 microns) and the die size as small as 5 mils (125 microns) square.
Valley provides precision dicing services for both R & D efforts as well as high volume contract dicing requirements.
For a complete summary of dicing capabilities click here.
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