MEMS Bonded Wafer Dicing

Whether or not your bonded wafers have etched patterns or circuitry, we will provide precise dicing of your chips.

Valley has the technology to handle Silicon-on-Glass, GaAs-on-Glass or Quartz , and any other bonded wafers. Depending on the material, the dicing kerf may be as small as 1mil (25 microns) and the die size as small as 5 mils (125 microns) square.

Valley provides precision dicing services for both R & D efforts as well as high volume contract dicing requirements.

For a complete summary of dicing capabilities click here.

Additional information on related Web sites:

• www.customdicing.com/custom-dicing Dicing, cutting and singulating different materials
• www.customdicing.com/edge-rounding Diced chip and substrate edge rounding
• www.siliconwafers.net Polished Silicon wafers
• www.siliconwafers.net/thinned Silicon wafers thinned to produce thinner dice
• www.ultra-thin.com/mems MEMS and Bonded SOI Silicon wafers
• www.memsnet.org MEMS information clearing house
  
• www.customdicing.com/wafer-dicing Wafer dicing, sawing, singulating and backgrinding
  

Return to Home Page: Dicing hybrid, semiconductor and dicing MEMS wafers

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