Aluminum Nitride Ceramic Substrates

Advantages of Aluminum Nitride include great thermal performance, low thermal expansion and non-toxicity.

Advantages of Aluminum Nitride include great thermal performance, low thermal expansion and non-toxicity.

• High thermal conductivity
• Low thermal expansion coefficient closely matching Silicon
• Good dielectric strength
• High electrical sensitivity
• Low toxicity and therefore excellent replacement for BeO
• Good shock and corrosion resistance
• Low dielectric loss
• High temperature stability
• High flexure strength
• Light weight
• Resistant to wafer processing gasses and plasma erosion
• Conducive to finishing operations such as lasering, lapping, and polishing
• Substrate for direct bond copper DBC and filled vias
• Good adhesion for thin and thick film applications
• Uniform lapped and polished surfaces for resistor networks
• Polished and lapped surface finishes to 1/2 micro-inch. Ra with minimum pullouts
• Lapped surface finishes to 6 micro-inch. Ra.

Properties -Typical

Additional Aluminum Nitride Information:

• www.aluminumnitride.com/polished Polished Aluminum Nitride AlN substrates and wafers
• www.quartz-silica.net AlN Aluminum Nitride chemical analysis
• www.valleydesign.com/substrate Aluminum Nitride AlN and Aluminum Oxide Ceramic substrates
• www.leoma.com Laser and Electro-Optical Manufactures Association
• www.acers.org American Ceramic Society
• www.edgepolishing.com/aluminum-nitride Aluminum Nitride mechanical and electrical properties
• www.laserslag.com/laser-drilling Laser drilling Aluminum Nitride and Alumina substrates
• www.customdicing.com Aluminum Nitride related information
• www.customdicing.com/wafer-dicing Wafer dicing, sawing, singulating and backgrinding

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